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Authors: Alireza Tajeddin, Nur Mustafaoglu, Murat Kaya Yapici
Journal title: 2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)
Journal publisher: IEEE
Published year: 2021
DOI identifier: 10.1109/dtip54218.2021.9568499
ISBN: 978-1-6654-0230-9