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Authors: Michal Ackermann, Jiří Šafka, Lukáš Voleský, Jiří Bobek, Jitendra Reddy Kondapally
Journal title: Materials Science Forum
Journal number: 919
Journal publisher: Trans Tech Publications Ltd.
Published year: 2018
Published pages: 43-51
DOI identifier: 10.4028/www.scientific.net/msf.919.43
ISSN: 1662-9752