Numerical modeling of wood-adhesive bond-line in mode II for spruce wood glued by various adhesives

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Authors: Sebera, Václav; Pečnik, Jaka Gašper; Azinovič, Boris; Kramar, Miha

Journal title: 4th International scientific conference of WOOD TECHNOLOGY & PRODUCT DESIGN, Ohrid, Macedonia, 4-7 September 2019

Journal publisher: Faculty of Design and Technologies of Furniture and Interior

Published year: 2019

DOI identifier: 10.5281/zenodo.3482863

ISBN: 978-608-4723-03-5