MODIFIED LIGNIN/PLA COMPOSITES FOR PACKAGING APPLICATION

Summary

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Authors: Esakkimuthu, Esakkiammal Sudha; DeVallance, David; Sipponen, Mika H.

Journal title: Proceedings of the 2nd InternationalConference on Circular Packaging

Journal publisher: Pulp and Paper Institute & Faculty of Polymer Science

Published year: 2021

Published pages: 93-97

DOI identifier: 10.5281/zenodo.5532469

ISBN: 978-961-90424-6-5