Thermal stability of a fully printed ultra-thin organic pre-amplifier circuit meant for on-skin applications

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Authors: Aregaw Kujansuu, Rei Shiwaku, Tomohito Sekine, Hiroyuki Matsui, Shizuo Tokito, Matti Mäntysalo, Mika-Matti Laurila

Journal title: 2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)

Journal number: 2023

Journal publisher: IEEE

Published year: 2023

Published pages: 1-4

DOI identifier: 10.1109/fleps57599.2023.10220378

ISBN: 978-1-6654-5733-0