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Authors: G. Martin, A. Poppe, S. Schöps, E. Kraker, C. Marty, W. Soer, J. Yu
Journal title: 27TH INTERNATIONAL WORKSHOP Thermal Investigations of ICs and Systems
Journal number: once per year
Journal publisher: IEEE
Published year: 2021
DOI identifier: 10.1109/therminic52472.2021.9626541
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