Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging

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Authors: Dong Hu, Leiming Du, Markus Alfreider, Jiajie Fan, Daniel Kiener, Guoqi Zhang

Journal title: Materials Science and Engineering: A

Journal number: 897

Journal publisher: Elsevier BV

Published year: 2024

Published pages: 146316

DOI identifier: 10.1016/j.msea.2024.146316

ISSN: 0921-5093