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Authors: S. Bonen, G. Cooke, T. Jager, A. Bharadwaj, S. Pati Tripathi, D. Céli, P. Chevalier, P. Schvan, and S. P. Voinigescu
Journal title: IEEE Microwave and Wireless Components Letters
Journal number: Vol. 32, N.6
Journal publisher: IEEE
Published year: 2022
Published pages: pp. 666-669
DOI identifier: 10.1109/lmwc.2022.3160716
ISSN: 1558-1764