3D interconnects for quantum computing

Summary

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Authors: Jaber Derakhshandeh, Anish Dangol, Tassawar Hussain, Heiko Stegmann, A. M. Vadiraj, Prathamesh Dhakras, Thomas Witters, Ehsan Shafahian, Punith Kumar M K, Carine Gerets, Aleksandar Radisic, Aldrin Vaquilar, Aksel Goehnermeier, Danny Wan, Andy Miller, Anne Jourdain, Vladimir Cherman, Gerald Beyer, Eric Beyne and Kristiaan De Greve

Journal title: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

Journal publisher: IEEE

Published year: 2024

DOI identifier: 10.1109/ectc51529.2024.00132

ISSN: 2377-5726