Thermal resistance in superconducting flip-chip assemblies

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Authors: J. Hätinen, E. Mykkänen, K. Viisanen, A. Ronzani, A. Kemppinen, L. Lehtisyrjä, J. S. Lehtinen, M. Prunnila

Journal title: Appl. Phys. Lett.

Journal publisher: American Institute of Physics

Published year: 2023

DOI identifier: 10.1063/5.0162409

ISSN: 0003-6951