Characterizations of indium interconnects for 3D quantum assemblies

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Authors: C. Feautrier, E. Deschaseaux, A. Gueugnot, J. Charbonnier, A. Plihon, L. Dupré, F. Henry, F. Berger, A. Pagot, S. Renet, O. Mailliart, C. Thomas

Journal title: ECTC

Journal publisher: Proceeding of IEEE

Published year: 2023