Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test

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Authors: Shenyi Liu, Vesa Vuorinen, Xing Liu, Olli Fredrikson, Sebastian Brand, Nikhilendu Tiwary, Josef Lutz, Mervi Paulasto-Kröckel

Journal title: IEEE Transactions on Power Electronics

Journal number: 39

Journal publisher: Institute of Electrical and Electronics Engineers (IEEE)

Published year: 2024

DOI identifier: 10.1109/TPEL.2024.3447909

ISSN: 0885-8993