System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms

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Authors: Medina R, Kein J, Ansaloni G, Zapater M, Abadal S, Alarcón E, Atienza D.

Journal title: In Proceedings of the 28th Asia and South Pacific Design Automation Conference 2023 Jan 16

Journal publisher: IEEE

Published year: 2023

ISBN: 978-1-4503-9783-4