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Authors: Koos, C.; Randel, S.; Freude, W.; Yokoyama, S.; Dalton L.-R.; Zwickel, H.; Kieningera, C.; Wolf S.; Kutuvantavida, Y.; Lauermann, M.; Miura, H.; Qiue, F.; Elder, D.-L.; Ummethala, S.; Billah, M.-R.; Blaicher, M.; Dietrich, P.-I.; Trappen, M.; Hoose, T.
Journal publisher: IEEE
Published year: 2019