A Laser Shock-Based Disassembly Process for Adhesively Bonded Ti/CFRP Parts

Summary

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Authors: Kormpos, Panagiotis1 ORCID icon Unaldi, Selen2 Berthe, Laurent2 Tserpes, Konstantinos1 ORCID icon

Journal title: Processes 2023,11, 506

Journal publisher: MDPI

Published year: 2023

DOI identifier: 10.3390/pr11020506

ISSN: 2227-9717