Numerical Simulation of the Symmetric Laser-Shock Based Disassembly Process for Adhesively Bonded TI/CFRP parts

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Authors: Kormpos, Panagiotis1, 2 Tserpes, Konstantinos1, 2 Unaldi, Selen3 Berthe, Laurent3

Journal title: X ECCOMAS Thematic Conference on Smart Structures and Materials SMART 2023 (SMART)

Journal publisher: Eccomas Proceedia

Published year: 2023

DOI identifier: 10.7712/150123.9953.444310