The Effect of Interfacial Charge on the Development of Wafer Bonded Silicon-on-Silicon-Carbide Power Devices

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Authors: Peter M. Gammon, Fan Li, C.W. Chan, Ana M. Sanchez, Steven A. Hindmarsh, Farzan Gity, Tanya Trajkovic, Valeriya Kilchytska, Vasantha Pathirana, Gianluca Camuso, Khaled Ben Ali, Denis Flandre, Philip A. Mawby, Julian W. Gardner

Journal title: Materials Science Forum

Journal number: 897

Journal publisher: TTP ltd

Published year: 2017

Published pages: 747-750

DOI identifier: 10.4028/www.scientific.net/MSF.897.747

ISSN: 1662-9752