Development, characterisation and simulation of wafer bonded Si-on-SiC substrates

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Authors: P.M. Gammon, C.W. Chan, F. Li, F. Gity, T. Trajkovic, V. Pathirana, D. Flandre, V. Kilchytska

Journal title: Materials Science in Semiconductor Processing

Journal number: 78

Journal publisher: Pergamon Press

Published year: 2018

Published pages: 69-74

DOI identifier: 10.1016/j.mssp.2017.10.020

ISSN: 1369-8001