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Authors: Reza Moloudi, Bart Vandevelde, Willem Verleysen, Silke G.C. Cleuren, Lucie Masquelet, Maik Sternberg, Adrian Stelzer, Andreas Burghardt, Przemyslaw Jakub Gromala
Journal title: 2024 30th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Journal publisher: IEEE
Published year: 2024
DOI identifier: 10.1109/THERMINIC62015.2024.10732871