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Authors: George Suciu, Octavian Fratu, Lucian Necula, Adrian Pasat, Victor Suciu
Journal title: 2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME)
Journal publisher: IEEE
Published year: 2016
Published pages: 114-117
DOI identifier: 10.1109/SIITME.2016.7777257
ISBN: 978-1-5090-4445-0