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Authors: Marton Nemeth, Andras Poppe
Journal title: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Journal publisher: IEEE
Published year: 2017
Published pages: 1-5
DOI identifier: 10.1109/THERMINIC.2017.8233792
ISBN:978-1-5386-1928-5
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