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Authors: Robin Bornoff, Volker Hildenbrand, Sangye Lugten, Genevieve Martin, Christophe Marty, Andras Poppe, Marta Rencz, Wil H.A. Schilders, Joan Yu
Journal title: 2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Journal publisher: IEEE
Published year: 2016
Published pages: 174-180
DOI identifier: 10.1109/THERMINIC.2016.7749048
ISBN:978-1-5090-5451-0
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