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Authors: A. Alexeev, R. Bornoff, S. Lungten, G. Martin, G. Onushkin, A. Poppe, M. Rencz, J. Yu
Journal title: 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Journal publisher: IEEE
Published year: 2017
Published pages: 1-8
DOI identifier: 10.1109/EuroSimE.2017.7926296
ISBN:978-1-5090-4344-6
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