From fan-out wafer to fan-out panel level packaging

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Authors: T. Braun, K.-F. Becker, S. Raatz, V. Bader, J. Bauer, R. Aschenbrenner, S. Voges, T. Thomas, R. Kahle, K.-D. Lang

Journal title: 2015 European Conference on Circuit Theory and Design (ECCTD)

Journal publisher: IEEE

Published year: 2015

Published pages: 1-4

DOI identifier: 10.1109/ECCTD.2015.7300046

ISBN: 978-1-4799-9877-7