Was nach den Modul-Tests kommt - dynamische und strukturelle Test auf höheren Ebenen

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Authors: Alexander Weiss; Thomas B. Preußer

Journal title: Embedded Software Engineering Kongress 2019

Journal publisher: MicroConsult GmbH; Vogel Communications Group GmbH & Co.KG

Published year: 2019

DOI identifier: 10.13140/rg.2.2.29714.89286