Algorithm to Design Conductive Mesh for Tamperproof Envelope

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Authors: Sorin Chi?u, Daniel Ciprian Vasile, Tudor Ioan Honceriu, Paul Svasta

Journal title: International Symposium for Design and Technology of Electronics Packages (SIITME)

Journal publisher: IEEE

Published year: 2020

DOI identifier: 10.1109/siitme50350.2020.9292275