Next Generation of Thermo-Compression Bonding Equipment

Summary

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Authors: Jonathan Abdilla, Martin Kainz, Benedikt Pressl, Mario Fraubaum, Chris Scanlan

Journal title: 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)

Journal publisher: IEEE

Published year: 2025

DOI identifier: 10.1109/EPTC62800.2024.10909759