Superconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under-bump metallization layer

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Authors: Achintya Paradkar, Paul Nicaise, Karim Dakroury, Fabian Resare, Witlef Wieczorek

Journal title: Applied Physics Letters

Journal number: 126

Journal publisher: AIP Publishing

Published year: 2025

DOI identifier: 10.1063/5.0235266

ISSN: 0003-6951