Industrial photonics packaging for high volume applications

Summary

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Authors: Milan Milosevic, Zerihun G. Tegegne, Chunting Zhong, David van Duinen, Xin Yin, Johan Bauwelinck, Maria Massaouti, Efstathios Andrianopoulos, Panos Groumas, Michael Theurer, Durvasa Y. Gupta, Martin Martin Kresse, Madeleine Weigel, David De Felipe, Norbert Keil, Joost van Kerkhof

Journal title: Optical Interconnects XXIV

Journal publisher: SPIE

Published year: 2024

DOI identifier: 10.1117/12.3000934