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Authors: Oliver Krammer, Gergely Hambuch, Réka Bátorfi, Balázs Illés, Attila Géczy
Journal title: 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME)
Journal publisher: IEEE
Published year: 2024
DOI identifier: 10.1109/SIITME63973.2024.10814765
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