Utilizing the superior etch stop quality of HfO2 in the front end of line wafer scale integration of silicon nanowire biosensors

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Authors: G. Jayakumar, P.-E. Hellström, M. Östling

Journal title: Microelectronic Engineering

Journal number: 212

Journal publisher: Elsevier BV

Published year: 2019

Published pages: 13-20

DOI identifier: 10.1016/j.mee.2019.03.006

ISSN: 0167-9317