Photonic Integrated Circuit based sensing modules with hybrid integration in the silicon nitride TriPleX™ platform

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Authors: Arne Leinse, Douwe Geuzebroek

Journal title: Optical Fiber Communication Conference (OFC) 2019

Journal publisher: OSA

Published year: 2019

Published pages: Tu2D.4

DOI identifier: 10.1364/ofc.2019.tu2d.4

ISBN: 978-1-943580-53-8