Periodic Reporting for period 2 - TERIPHIC (Fabrication and assembly automation of TERabit optical transceivers based on InP EML arrays and a Polymer Host platform for optical InterConnects up to 2 km and beyond)

The capability to provide Terabit capacity and the possibility for high-volume production at low cost are the two main requirements that rule the development of next generation optical modules for datacom applications. The 400GbE standards have been approved recently, however...