Tools for Simulation Workflow Management and their Application to Interconnect Modelling

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Authors: S. M. Amoroso, A. Pender, A. Brown, D. Reid, E. Towie, P. Asenov, C. Millar and A. Asenov

Journal title: 2016 IEEE International Conference on Simulation of Semiconductor Processes and Devices

Journal publisher: SISPAD 2016

Published year: 2016