Understanding Electromigration in Cu-CNT Composite Interconnects: A Multiscale Electrothermal Simulation Study

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Authors: Jaehyun Lee, Salim Berrada, Fikru Adamu-Lema, Nicole Nagy, Vihar P. Georgiev, Toufik Sadi, Jie Liang, Raphael Ramos, Hamilton Carrillo-Nunez, Dipankar Kalita, Katharina Lilienthal, Marcus Wislicenus, Reeturaj Pandey, Bingan Chen, Kenneth B. K. Teo, Goncalo Goncalves, Hanako Okuno, Benjamin Uhlig, Aida Todri-Sanial, Jean Dijon, Asen Asenov

Journal title: IEEE Transactions on Electron Devices

Journal number: 65/9

Journal publisher: Institute of Electrical and Electronics Engineers

Published year: 2018

Published pages: 3884-3892

DOI identifier: 10.1109/TED.2018.2853550

ISSN: 0018-9383