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Authors: Fabian Konemann, Morten Vollmann, Fabian Menges, I-Ju Chen, Norizzawati Mohd Ghazali, Tomohiro Yamaguchi, Koji Ishibashi, Claes Thelander, Bernd Gotsmann
Journal title: 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Journal publisher: IEEE
Published year: 2018
Published pages: 1-6
DOI identifier: 10.1109/therminic.2018.8593312
ISBN: 978-1-5386-6759-0