Characterization of Interconnects on Multilayer High Frequency PCB for D- Band

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: Antti Lamminen, Markku Lahti, David del Rio, Jussi Saily, Juan F. Sevillano, Vladimir Ermolov

Journal title: 2020 2nd 6G Wireless Summit (6G SUMMIT)

Journal publisher: IEEE

Published year: 2020

Published pages: 1-5

DOI identifier: 10.1109/6gsummit49458.2020.9083918

ISBN: 978-1-7281-6047-4