From thin film to bulk 3C-SiC growth: Understanding the mechanism of defects reduction

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Authors: F. La Via, A. Severino, R. Anzalone, C. Bongiorno, G. Litrico, M. Mauceri, M. Schoeler, P. Schuh, P. Wellmann

Journal title: Materials Science in Semiconductor Processing

Journal number: 78

Journal publisher: Pergamon Press

Published year: 2018

Published pages: 57-68

DOI identifier: 10.1016/j.mssp.2017.12.012

ISSN: 1369-8001