A Novel Packaging and System-Integration Platform with Integrated Antennas for Scalable, Low-Cost and High-Performance 5G mmWave Systems

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Authors: Ivan Ndip, Kristoffer Andersson, Stefan Kosmider, Thi Huyen Le, Abhijeet Kanitkar, Marius van Dijk, Kavin Senthil Murugesan, Uwe Maas, Thomas Loher, Marco Rossi, Johannes Jaeschke, Andreas Ostmann, Rolf Aschenbrenner, Martin Schneider-Ramelow, Klaus-Dieter Lang

Journal title: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

Journal publisher: IEEE

Published year: 2020

Published pages: 101-107

DOI identifier: 10.1109/ectc32862.2020.00029

ISBN: 978-1-7281-6180-8