Cu-Cu Thermocompression Bonding with Cu-Nanowire Films for Power Semiconductor Die-Attach on DBC Substrates

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Authors: Zechun Yu, Ying Zhao Tan, Christoph F. Bayer, Hubert Rauh, Andreas Schletz, Martin März, Olav Birlem

Journal title: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

Journal publisher: IEEE

Published year: 2021

DOI identifier: 10.1109/eptc53413.2021.9663890