Implant heating contribution to amorphous layer formation: a KMC approach

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: P.L. Julliard, P. Dumas, F. Monsieur, F. Hilario, D. Rideau, A. Hemeryck, F. Cristiano

Journal title: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

Journal publisher: IEEE

Published year: 2020

Published pages: 43-46

DOI identifier: 10.23919/sispad49475.2020.9241608

ISBN: 978-4-86348-763-5