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Project website, twitter account & social media

Project: PhotonicLEAP

Updated at: 29-04-2024

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Project acronym PhotonicLEAP

Demonstration of a Single-Mode Expanded-Beam Connectorized Module for Photonic Integrated Circuits

Project: PhotonicLEAP

Updated at: 29-04-2024

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Project acronym PhotonicLEAP

Integrated Photonics Packaging: Challenges and Opportunities

Project: PhotonicLEAP

Updated at: 29-04-2024

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Project acronym PhotonicLEAP

Reference Thermal Chips for 2D and 3D Co-packaging Process Development

Project: PhotonicLEAP

Updated at: 29-04-2024

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Project acronym PhotonicLEAP

Substrate integrated micro-thermoelectric coolers in glass substrate for next-generation photonic packages

Project: PhotonicLEAP

Updated at: 29-04-2024

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Project acronym PhotonicLEAP

Design and Optimizing Backside Grating Couplers in Si-Photonics Circuits

Project: PhotonicLEAP

Updated at: 29-04-2024

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Project acronym PhotonicLEAP

Impact of Through Glass Vias Filling on the Performance of Passive Thermal Cooling in Photonic Packages

Project: PhotonicLEAP

Updated at: 29-04-2024

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Project acronym PhotonicLEAP

High Aspect Ratio Through-Glass Vias as Heat Conductive Element

Project: PhotonicLEAP

Updated at: 29-04-2024

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Project acronym PhotonicLEAP

First press release about PhotonicLEAP project

Project: PhotonicLEAP

Updated at: 31-10-2023

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Project acronym PhotonicLEAP

Periodic Reporting for period 1 - PhotonicLEAP (Photonic Wafer-Level Integration Packaging and Test)

Project: PhotonicLEAP

Updated at: 18-07-2023

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Project acronym PhotonicLEAP

Resources

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Project website, twitter account & social media

Demonstration of a Single-Mode Expanded-Beam Connectorized Module for Photonic Integrated Circuits

Integrated Photonics Packaging: Challenges and Opportunities

Reference Thermal Chips for 2D and 3D Co-packaging Process Development

Substrate integrated micro-thermoelectric coolers in glass substrate for next-generation photonic packages

Design and Optimizing Backside Grating Couplers in Si-Photonics Circuits

Impact of Through Glass Vias Filling on the Performance of Passive Thermal Cooling in Photonic Packages

High Aspect Ratio Through-Glass Vias as Heat Conductive Element

First press release about PhotonicLEAP project

Periodic Reporting for period 1 - PhotonicLEAP (Photonic Wafer-Level Integration Packaging and Test)