Delivery of Alumina PCB’s carrying packaged MMICs

Summary
Package test structures prepared with solder bumps, e.g., 50 ohm through line will be attached to alumina PCBs.
More information & hyperlinks
Web resources: https://ec.europa.eu/research/participants/documents/downloadPublic?documentIds=080166e5e3794a4c&appId=PPGMS
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