Delivery of wafers carrying SS and PA MMICs

The wafers manufactured using the mask-sets based on MMIC designs from MC2 and CHALMERS will be made available to the partners of the projects. Wafers will be submitted to on-wafer testings and then diced. Some chips will be kept for bare-die characterization and other MMIC’s will be sent to Fraunhofer for packaging. Tracability will be kept between MMICs version and between Run 1 and Run 2 of manufacturing