Room Temperature Interconnection Technology for Bonding Fine Pitch Bumps Using NanoWiring, KlettWelding, KlettSintering and KlettGlueing

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Authors: F. ROUSTAIE, S. QUEDNAU, F. DASSINGER, O. BIRLEM

Journal title: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Journal publisher: IEEE

Published year: 2020

Published pages: 168-171

DOI identifier: 10.1109/impact50485.2020.9268570

ISBN: 978-1-7281-9851-4