Characterization of failure modes at extremely accelerating conditions

This deliverable linked to Task T2.5 will collect the results obtained on the failure mode analysis performed on the memory cells and memory blocks fabricated in Run 2 and Run 3. In particular, the failure mode analysis will consist of: -Electrical characterization at higher temperature, electrical overstress, humidity, mechanical vibration, and thermal shock -Physical characterization at higher temperature, overstress, humidity, mechanical vibration, and thermal shock. A first version obtained on Run 2 devices will be launched at M23. This results will be used for improving devices fabricated in Run 3. The results regarding Run3 devices will be contained in the upgraded version of this deliverable will be available at M30.