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Authors: F. Tcheme Wakam, J. Lacord, S. Martinie, J.-Ch. Barbe, F. Tcheme Wakam, M. Bawedin, S. Cristoloveanu
Journal title: 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
Journal publisher: IEEE
Published year: 2017
Published pages: 329-332
DOI identifier: 10.23919/SISPAD.2017.8085331
ISBN: 978-4-86348-610-2
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