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European Partnerships

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EU-Programme-Call

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8 items found

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SOIL | Solidify the European FDSOI Ecosystem Accelerating its Industrial Deployment

01-06-2024

31-05-2027

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Organisation ION BEAM SERVICES (IBS)

10ACe | 10 Angstrom CMOS exploration

01-05-2024

30-04-2027

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Organisation ION BEAM SERVICES (IBS)

YESvGaN | Vertical GaN on Silicon: Wide Band Gap Power at Silicon Cost

01-05-2021

31-10-2024

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Organisation ION BEAM SERVICES (IBS)

FastLane | Boosting the European Value Chain for Sustainable Power Electronics

01-05-2024

30-04-2027

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Organisation ION BEAM SERVICES (IBS)

14ACMOS | 14 Anstrom CMOS IC technology

01-12-2022

30-11-2025

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Organisation ION BEAM SERVICES (IBS)

HighLite | High-performance low-cost modules with excellent environmental profiles for a competitive EU PV manufacturing industry

01-10-2019

31-03-2023

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Organisation ION BEAM SERVICES (IBS)

GreenDiamond | Green Electronics with Diamond Power Devices

01-05-2015

31-10-2020

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Organisation ION BEAM SERVICES (IBS)

CHALLENGE | 3C-SiC Hetero-epitaxiALLy grown on silicon compliancE substrates and 3C-SiC substrates for sustaiNable wide-band-Gap powEr devices

01-01-2017

30-06-2021

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Organisation ION BEAM SERVICES (IBS)

Projects overview

Selected filters:

SOIL | Solidify the European FDSOI Ecosystem Accelerating its Industrial Deployment

10ACe | 10 Angstrom CMOS exploration

YESvGaN | Vertical GaN on Silicon: Wide Band Gap Power at Silicon Cost

FastLane | Boosting the European Value Chain for Sustainable Power Electronics

14ACMOS | 14 Anstrom CMOS IC technology

HighLite | High-performance low-cost modules with excellent environmental profiles for a competitive EU PV manufacturing industry

GreenDiamond | Green Electronics with Diamond Power Devices

CHALLENGE | 3C-SiC Hetero-epitaxiALLy grown on silicon compliancE substrates and 3C-SiC substrates for sustaiNable wide-band-Gap powEr devices