ERD

Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Communication & dissemination yearly report 2

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Photonic-integrated circuits with non-planar topologies realized by 3D-printed waveguide overpasses

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Superconducting nanowire single-photon detector with 3D-printed free-form microlenses

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

3D-Printed Optics for Wafer-Scale Probing

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Communication & dissemination plan

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Project start communication kit

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Mid-termCommunication Kit

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Communication & dissemination yearly report 1

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Pilot Line infrastructure inventory

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Thermal management processes

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Photonic-Electronic Ultra-Broadband Signal Processing: Concepts, Devices, and Applications

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Large Scale Manufacturing of SiN Reference PICs for Industrial Packaging

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Fiber-less Photonic Package

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

3D-printed optical probes for wafer-level testing of photonic integrated circuits

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration – from Lab Demonstrations to Production

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Training activity report

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Communication & dissemination yearly report 3

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Communication & dissemination yearly report 4

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Hardwired Configurable Photonic Integrated Circuits Enabled by 3D Nanoprinting

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Printed freeform lens arrays on multi-core fibers for highly efficient coupling in astrophotonic systems

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Project website, twitter account & social media profile

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Press release announcing Pilot Line project

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Final Communication Kit

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Fiber-less Photonic Package

Project: PIXAPP

Updated at: 29-04-2024

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Project acronym PIXAPP

Periodic Reporting for period 3 - PIXAPP (Photonic Integrated Circuits Assembly and Packaging Pilot Line)

Project: PIXAPP

Updated at: 29-09-2022

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Project acronym PIXAPP

Resources

Selected filters:

Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics

Communication & dissemination yearly report 2

Photonic-integrated circuits with non-planar topologies realized by 3D-printed waveguide overpasses

Superconducting nanowire single-photon detector with 3D-printed free-form microlenses

3D-Printed Optics for Wafer-Scale Probing

Communication & dissemination plan

Project start communication kit

Mid-termCommunication Kit

Communication & dissemination yearly report 1

Pilot Line infrastructure inventory

Thermal management processes

Photonic-Electronic Ultra-Broadband Signal Processing: Concepts, Devices, and Applications

Large Scale Manufacturing of SiN Reference PICs for Industrial Packaging

Fiber-less Photonic Package

3D-printed optical probes for wafer-level testing of photonic integrated circuits

Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration – from Lab Demonstrations to Production

Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography

Training activity report

Communication & dissemination yearly report 3

Communication & dissemination yearly report 4

Hardwired Configurable Photonic Integrated Circuits Enabled by 3D Nanoprinting

Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements

Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding

Printed freeform lens arrays on multi-core fibers for highly efficient coupling in astrophotonic systems

In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration

Project website, twitter account & social media profile

Press release announcing Pilot Line project

Final Communication Kit

Fiber-less Photonic Package

Periodic Reporting for period 3 - PIXAPP (Photonic Integrated Circuits Assembly and Packaging Pilot Line)